By Chuan Seng Tan, Kuan-Neng Chen, Visit Amazon's Steven J. Koester Page, search results, Learn about Author Central, Steven J. Koester,
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality development in built-in circuits (IC) because the traditional scaling procedure is confronted with exceptional demanding situations in basic and financial limits. Wafer point 3D IC can take a number of kinds, they usually often comprise a stack of numerous thinned IC layers which are vertically bonded and interconnected by means of via silicon through TSV.
There is a protracted string of advantages that it is easy to derive from 3D IC implementation comparable to shape issue, density multiplication, better hold up and gear, more desirable bandwidth, and heterogeneous integration. This ebook offers contributions by way of key researchers during this box, masking motivations, expertise structures, purposes, and different layout matters.